Welcome Prof. Limeng Yin from Chongqing University of Science and Technology​ to be committee member!

日期：2018-02-07 点击量：  276次

Prof. Limeng Yin

Chongqing University of Science and Technology

School of Metallurgy and Materials Engineering

Research Area: Electronic Packaging and Mechanical Reliability

Research Exprience: 

Doctoral Candidate

2006.09-2009.06 South China University of Technology, China

Study on size effects and electromigration of mechanical properties of micro-interconnection solder joints for electronic packaging (Dissertation)

Visiting Scholar

2011.10-2012.10, University of Maryland, College Park, USA

Lead-free solder alloys and relative reliability for microelectronic packaging

Master's Supervisor/Professor

2014.09-, Chongqing University of Science and Technology, China

Principal investigator of the National Natural Science Foundation of China (NSFC) under Grant No. 51674056, the Achievement Transfer Program of Institutions of Higher Education in Chongqing under Grant No. KJZH17137, the Research Program of Frontier and Applied Basic Research of Chongqing under Grant No. cstc2015jcyjA50017, the Scientific and Technological Research Program of Chongqing Municipal Education Commission under Grant No. KJ131415, and the State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology under Grant No. AWJ-M15-05.