Welcome Prof. Limeng Yin from Chongqing University of Science and Technology to be committee member!
日期：2018-02-07 点击量： 688次
Prof. Limeng Yin
Chongqing University of Science and Technology
School of Metallurgy and Materials Engineering
Research Area: Electronic Packaging and Mechanical Reliability
2006.09-2009.06 South China University of Technology, China
Study on size effects and electromigration of mechanical properties of micro-interconnection solder joints for electronic packaging (Dissertation)
2011.10-2012.10, University of Maryland, College Park, USA
Lead-free solder alloys and relative reliability for microelectronic packaging
2014.09-, Chongqing University of Science and Technology, China
Principal investigator of the National Natural Science Foundation of China (NSFC) under Grant No. 51674056, the Achievement Transfer Program of Institutions of Higher Education in Chongqing under Grant No. KJZH17137, the Research Program of Frontier and Applied Basic Research of Chongqing under Grant No. cstc2015jcyjA50017, the Scientific and Technological Research Program of Chongqing Municipal Education Commission under Grant No. KJ131415, and the State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology under Grant No. AWJ-M15-05.