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Welcome to ICEDME2020

The previous First 2018 International Conference on Electron Device and Mechanical EngineeringICEDME 2018was successfully held in Wuhan,China during March 23-25, 2018. The 2019 2nd International Conference on Electron Device and Mechanical EngineeringICEDME 2019was successfully held in Suzhou,China during March 29-31, 2019. 

Welcome to the official website of the 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME 2020),which will be held in Suzhou,China during March 20-22, 2020. ICEDME 2020 is organized by AEIC Academy Exchange Information Centre. It is a yearly International conference which the experts of this kind of field from different areas and countries will be invited to give the relevant speech. ICEDME 2020 is to provide a platform for researchers, professionals and other experts from around the world to present their research results in Electron Device and Mechanical Engineering.


2020 3rd International Conference on Electron Device and Mechanical Engineering(ICEDME 2020) is a leading conference for all researchers from different countries and territories to present their research results about Electron Device and Mechanical Engineering.


As an influential international conference, ICEDME 2020 provides the experts with a valued opportunity to communicate with each other coving its large team, dependable committee and a large of sponsors from all over the world. A lot of participants from many kinds of fields will join in this grand international conference.


1. All accepted full papers will be published in Journal of Physics: Conference Series(ISSN: 1742-6588) and will be submitted to EI Compendex and Scopus for indexing.


所有的投稿都必须经过2-3位组委会专家审稿,经过严格的审稿之后,最终所有录用的论文将由Conference Proceedings出版,见刊后由期刊社提交至EI和Scopus检索,目前该期刊EI检索非常稳定。往届论文已被EI检索!

ICEDME2018检索记录: click 

ICEDME2019检索记录: click 

2. SCI journal(Submission with notes of conference acronyms will enjoy priority in review and acceptance.)

Excellent papers will be recommended directly to the following or other suitable SCI journals 

Journal 1:Journal of Materials Science: Materials in Electronics(ISSN: 0957-4522, IF=2.195, regular issue)

Journal 2:Thermal Science(ISSN: 0354-9836, IF=1.541, special issue)

Submission should be in WORD(.doc)format only, and specified templates will be given after evaluation.  

Online submission 【AIS online submission

For more information about SCI papers and journals, please feel free to contact Editor Li(WeChat/Mobile phone): 18127812811/ Editor Lin(WeChat/Mobile phone): 13922157504.

Submission Guide

A. Full Paper (for Presentation and Publication)

Accepted full paper will be invited to give the oral presentation at the conference and be publsihed in the conference proceedings.


B. Abstract (Presentation only)

Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.


C. EI Template (Download)

   *All submissions must not be less than 4 pages in length.

    (authors will be charged extra 50 USD/page if the manuscript length is more than 4 pages)


D.Submission Methods

Please send the full paper & abstract to SUBMISSION SYSTEM.(word and pdf)